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description precision optical performance alingap ii (alu minum indi - um gallium phosphide) leds ofer superior light output for excellent readability in sunlight and dependable per - for m ance. the alingap ii technology provides extremely stable light output over long periods of ti m e. these led la m ps are untinted, nondifused, t-1 3 / 4 pack - ages incorporating second generation optics which pro - duce well defned radiation patterns at specifc viewing cone angles. these la m ps are m ade with an advanced optical grade epoxy ofering superior high te mper a ture and high m oisture resistance perfor m ance in outdoor signal and sign applications. the maximum led junction tem pera- ture li m it of +130c enables high tem perature operation in bright sunlight conditions. the epoxy contains both uv-a and uv - b inhibitors to reduce the efects of long ter m exposure to direct sunlight. benefts ? viewing angles m atch trafc m anage m ent require - m ents ? colors m eet autom otive and trafc signal specifca - tions ? superior light output perfor m ance in outdoor environ - m ents ? suitable for autoinsertion into pc boards features ? well defned spatial radiation patterns ? viewing angles: 15 , 23 , 30 ? high lu minous output ? colors: 592 nm a mber 617 nm reddish-orange 630 nm red ? high operating te m perature: t jled = +130c ? superior resistance to m oisture applications ? trafc managem ent: trafc signals work zone warning lights variable m essage signs ? co mm ercial outdoor advertising: signs marquees ? auto m otive: exterior and interior lights hlmp-elxx, hlmp-ehxx, hlmp-edxx precision optical performance alingap ii led lamps data sheet
2 t-1 3 / 4 (5 mm) precision optical performance alingap ii led lamps selection guide typical viewing angle 2 q 1 / 2 (deg.) [2] color and dominant wavelength (nm), typ. [1] lamps without standofs (outline drawing a) lamps with standofs (outline drawing b) luminous intensity iv (mcd) [3,4,5] @ i(f) = 20 ma min. max. 15 a mber 592 hlmp-el16-s0000 hlmp-el18-s0000 1900 C hlmp-el16-tw000 2500 7200 hlmp-el16-ux000 hlmp-el18-ux000 3200 9300 hlmp-el16-uxr00 3200 9300 hlmp-el16-vw000 4200 7200 hlmp-el16-vx400 7200 21000 hlmp-el16-vy000 hlmp-el18-vy000 4200 12000 hlmp-el16-vyr00 hlmp-el18-vyr00 4200 12000 hlmp-el16-vyk00 4200 12000 hlmp-el16-vys00 hlmp-el18-vys00 4200 12000 red-orange 617 hlmp-eh16-tw000 2500 7200 hlmp-eh16-ux000 hlmp-eh18-ux000 3200 9300 hlmp-eh16-vx0dd 4200 9300 red 630 hlmp-ed16-s0000 hlmp-ed18-s0000 1900 C hlmp-ed16-tw000 hlmp-ed18-tw000 2500 7200 hlmp-ed18-twt00 2500 7200 hlmp-ed16-ux000 hlmp-ed18-ux000 3200 9300 hlmp-ed16-uxt00 hlmp-ed18-uxt00 3200 9300 hlmp-ed16-vx000 hlmp-ed18-vx000 4200 9300 notes: 1. do m inant wavelength, d , is derived fro m the cie chrom aticity diagram and represents the color of the lam p. 2. q 1/2 is the of-axis angle where the lu m inous intensity is one half the on-axis intensity. 3. the lu m inous intensity is m easured on the mechanical axis of the lam p package. 4. the optical axis is closely aligned with the package m echanical axis. 5. tolerance for each intensity bin li mit is 15%.
3 t-1 3 / 4 (5 mm) precision optical performance alingap ii led lamps (continued) selection guide typical viewing angle 2 q 1 / 2 (deg.) [2] color and dominant wavelength (nm), typ. [1] lamps without standofs (outline drawing a) lamps with standofs (outline drawing b) luminous intensity iv (mcd) [3,4,5] @ i(f) = 20 ma min. max. 23 a mber 592 hlmp-el25-q0000 hlmp-el27-q0000 1150 C hlmp-el27-qtr00 1150 3200 hlmp-el25-ru000 hlmp-el27-ru000 1500 4200 hlmp-el25-su000 1900 4200 hlmp-el25-svk00 1900 5500 hlmp-el25-sv000 hlmp-el27-sv000 1900 5500 hlmp-el25-svr00 hlmp-el27-svr00 1900 5500 hlmp-el25-tw000 hlmp-el27-tw000 2500 7200 hlmp-el25-twr00 hlmp-el27-twr00 2500 7200 hlmp-el25-twk00 2500 7200 hlmp-el25-tws00 2500 7200 hlmp-el25-ux000 3200 9300 red-orange 617 hlmp-eh25-qt000 hlmp-eh27-qt000 1150 3200 hlmp-eh25-sv000 1900 5500 hlmp-eh25-tw000 hlmp-eh27-tw000 2500 7200 red 630 hlmp-ed25-ru000 3200 9300 hlmp-ed25-rut00 3200 9300 hlmp-ed25-sv000 hlmp-ed27-sv000 1900 5500 hlmp-ed25-tw000 hlmp-ed27-tw000 2500 7200 hlmp-ed25-twt00 hlmp-ed27-twt00 2500 7200 notes: 1. do m inant wavelength, d , is derived fro m the cie chrom aticity diagram and represents the color of the lam p. 2. q 1/2 is the of-axis angle where the lu m inous intensity is one half the on-axis intensity. 3. the lu m inous intensity is m easured on the mechanical axis of the lam p package. 4. the optical axis is closely aligned with the package m echanical axis. 5. tolerance for each intensity bin li mit is 15%.
4 t-1 3 / 4 (5 mm) precision optical performance alingap ii led lamps (continued) selection guide typical viewing angle 2 q 1 / 2 (deg.) [2] color and dominant wavelength (nm), typ. [1] lamps without standofs (outline drawing a) lamps with standofs (outline drawing b) luminous intensity iv (mcd) [3,4,5] @ i(f) = 20 ma min. max. 30 a mber 592 hlmp-el31-p0000 880 C hlmp-el31-qt000 hlmp-el33-qt000 1150 3200 hlmp-el31-qtr00 1150 3200 hlmp-el31-sv000 hlmp-el33-sv000 1900 5500 hlmp-el31-svk00 1900 5500 hlmp-el31-svr00 hlmp-el33-svr00 1900 5500 hlmp-el31-str00 1900 3200 hlmp-el31-suk00 1900 4200 hlmp-el31-sus00 1900 4200 hlmp-el31-sur00 1900 4200 hlmp-el31-svk00 1900 5500 hlmp-el31-svs00 1900 5500 red-orange 617 hlmp-eh31-qt000 1150 3200 hlmp-eh33-ru000 1500 4200 hlmp-eh31-sv000 hlmp-eh33-sv000 1900 5500 red 630 hlmp-ed31-q0000 hlmp-ed33-q0000 1150 C hlmp-ed31-qtt00 1150 3200 HLMP-ED31-ST000 1900 3200 hlmp-ed31-sut00 1900 4200 hlmp-ed31-ru000 1500 4200 hlmp-ed31-rut00 hlmp-ed33-rut00 1500 4200 hlmp-ed31-sv000 hlmp-ed33-sv000 1900 5500 hlmp-ed31-svt00 hlmp-ed33-svt00 1900 5500 notes: 1. do m inant wavelength, d , is derived fro m the cie chrom aticity diagram and represents the color of the lam p. 2. q 1/2 is the of-axis angle where the lu m inous intensity is one half the on-axis intensity. 3. the lu m inous intensity is m easured on the mechanical axis of the lam p package. 4. the optical axis is closely aligned with the package m echanical axis. 5. tolerance for each intensity bin li mit is 15%.
5 hlmp- x x xx - x x x xx mechanical options 00: bulk packaging dd: a mm o pack yy: flexi-bin, bulk packaging zz: flexi-bin; a mm o pack color bin & v f selections 0: no color bin li m itation 4: a m ber color bin 4 only k: a m ber color bins 2 and 4 only l: color bins 4 and 6 r: a m ber color bins 1, 2, 4, and 6 with v f m ax of 2.6 v s: a m ber color bins 2 and 4 with v f m ax of 2.6 v t: red color with v f m ax of 2.6 v u: a m ber color bin 4 with v f m ax of 2.6 v w: color bins 2, 4 and 6 with v f m ax of 2.6 v y: color bins 4 and 6 with v f m ax of 2.6 v maximum intensity bin 0: no iv bin li m itation minimum intensity bin viewing angle and lead standofs 16: 15 degree without lead standofs 18: 15 degree with lead standofs 25: 23 degree without lead standofs 27: 23 degree with lead standofs 31: 30 degree without lead standofs 33: 30 degree with lead standofs color d: 630 nm red h: 617 nm red-orange l: 592 nm a mber package e: 5 mm round part numbering system note: please refer to ab 5337 for co m plete infor m ation on part num bering system.
6 absolute maximum ratings at t a = 25c dc forward current [1,2,3] ..................................................................................... 50 ma peak pulsed forward current [2,3] ....................................................................... 100 ma average forward current ...................................................................................... 30 ma reverse voltage (i r = 100 a) ........................................................................................ 5 v led junction te m perature ....................................................................................... 130c operating te m perature ......................................................................... -40c to +100c storage te m perature .............................................................................. -40c to +100c notes: 1. derate linearly as shown in figure 4. 2. for long ter m perfor m ance with minim al light output degradation, drive currents between 10 ma and 30 m a are recomm ended. for m ore infor m ation on recomm ended drive condi - tions, please refer to application brief i-024 (5966-3087e). 3. please contact your sales representative about operating currents below 10 ma. package dimensions a b 2.35 (0.093) max. 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat 8.71 0.20 (0.343 0.008 1.14 0.20 (0.045 0.008) 1.14 0.20 (0.045 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead d 1.50 0.15 (0.059 0.006) 5.80 0.20 (0.228 0.008) 2.54 0.38 (0.100 0.015) cathode flat part no. d hlmp-ex18-xxxxx 12.60 0.18 (0.496 0.007) hlmp-ex27-xxxxx 11.33 0.25 (0.446 0.010) hlmp-ex33-xxxxx 11.99 0.25 (0.472 0.010)
7 electrical/optical characteristics at t a = 25c parameter symbol min. typ. max. units test conditions forward voltage i f = 20 ma a mber ( d = 592 nm) 2.3 red-orange ( d = 617 nm) v f 2.35 2.6 [1] v red ( d = 630 nm) 2.4 reverse voltage v r 5 20 v i r = 100 a peak wavelength peak of wavelength of a mber 594 spectral distribution red-orange peak 623 nm at i f = 20 ma red 639 spectral halfwidth ? 1/2 17 nm wavelength width at spectral distrib- ution 1 / 2 power point at i f = 20 ma speed of response t s 20 ns exponential ti me constant, e -t/t s capacitance c 40 pf v f = 0, f = 1 mhz ther m al resistance r q j-pin 240 c/w led junction-to-cathode lead lu m inous efcacy [2] em itted luminous a mber 500 power/e m itted radiant power red-orange h v 235 lm/w at i f = 20 ma red 155 lu m inous flux j v 1000 mlm if = 20 ma lu m inous efciency [3] h e em itted a mber 22 lu m inous flux/ red-orange 22 lm/w electrical power red 21 notes: 1. for options -xxrxx, -xxsxx, -xxtxx, -xxuxx, -xxwxx, -xxyxx, m ax forward voltage (vf ) is 2.6 v. refer to vf bin table. 2. the radiant intensity, i e , in watts per steradian, m ay be found from the equation i e = i v / h v , where i v is the lum inous intensity in candelas and h v is the lum inous efcacy in lum ens/watt. 3. h e = j v / i f x v f , where j v is the em itted luminous fux, i f is electrical forward current and v f is the forward voltage. figure 1. relative intensity vs. peak wavelength. figure 2a. forward current vs. forward voltage for option -xxrxx, -xxsxx, -xxtxx, -xxuxx, -xxwxx and -xxyxx. wavelength ? nm relative intensity 550 600 650 700 1.0 0.5 0 amber red-orange red dc forward current ? ma 0 0 forward voltage ? v 2.5 40 30 0.5 1.5 60 3.0 10 20 50 red 1.0 2.0 amber
8 figure 6. representative spatial radiation pattern for 23 viewing angle lamps. figure 3. relative luminous intensity vs. forward current. figure 4. maximum forward current vs. ambient tem - perature. derating based on t jmax = 130c. figure 5. representative spatial radiation pattern for 15 viewing angle lamps. figure 2b. forward current vs. forward voltage. current ? ma 1.0 0 v f ? forward voltage ? v 2.5 100 40 30 1.5 2.0 60 3.0 10 20 50 red 70 80 90 amber relative intensity (normalized at 20 ma) 0 0 forward current ? ma 40 2.0 1.5 1.0 0.5 20 50 2.5 10 30 amber red & red-orange i f max. ? maximum forward current ? ma 0 0 t a ? ambient temperature ? c 40 80 50 45 35 25 15 5 55 40 30 20 10 20 60 100 120 1.0 0.8 0.6 0.4 0.2 -100 -50 0 5 0 100 0 angular displacement ? degrees normalized intensity ? % 1.0 0.8 0.6 0.4 0.2 -100 -50 0 5 0 100 0 angular displacement ? degrees normalized intensity ? %
9 bin name min. max. 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 bin name min. max. p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 intensity bin limits (mcd at 20 ma) tolerance for each bin li mit is 15%. amber color bin limits (nm at 20 ma) tolerance for each bin li mit is 0.5 nm. notes: 1. bin categories are established for classif - cation of products. products m ay not be available in all bin categories. figure 7. representative spatial radiation pattern for 30 viewing angle lamps. bin name min. max. va 2.0 2.2 vb 2.2 2.4 vc 2.4 2.6 vf bin table [2] tolerance for each bin li m it is 0.05 v. 2. vf bin table only available for those part number with options -xxrxx, -xxsxx, -xx - txx, -xxuxx, -xxwxx, -xxyxx. figure 8. relative light output vs. junction temperature 0.1 relative lop (normalized at 25 c) junction temperature ? c -50 10 1 -25 0 2 5 5 0 7 5 150 100 125 red red-orange amber 1.0 0.8 0.6 0.4 0.2 -100 -50 0 5 0 100 0 angular displacement ? degrees normalized intensity ? %
10 precautions: lead forming: ? the leads of an led la mp m ay be prefor m ed or cut to length prior to insertion and soldering on pc board. ? for better control, it is reco mm ended to use proper tool to precisely for m and cut the leads to applicable length rather than doing it m anually. ? if m anual lead cutting is necessary, cut the leads after the soldering process. the solder connection for ms a m echanical ground which prevents mechanical stress due to lead cutting fro m traveling into led package. this is highly reco mm ended for hand solder operation, as the excess lead length also acts as s mall heat sink. soldering and handling: ? care m ust be taken during pcb assem bly and soldering process to prevent da m age to the led com ponent. ? led co m ponent m ay be efectively hand soldered to pcb. however, it is only reco mm ended under unavoidable circu m stances such as rework. the closest m anual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm . soldering the led using soldering iron tip closer than 1.59mm m ight dam age the led. note: 1. pcb with diferent size and design (co m ponent density) will have diferent heat m ass (heat capacity). this m ight cause a change in te m perature experienced by the board if sam e wave soldering setting is used. so, it is reco mm ended to re-calibrate the soldering profle again before loading a new type of pcb. 2. avago technologies high brightness led are using high efciency led die with single wire bond as shown below. custo m er is advised to take extra precaution during wave soldering to ensure that the maximum wave tem perature does not exceed 250c and the solder contact ti m e does not exceeding 3sec. over-stressing the led during soldering process m ight cause prem ature failure to the led due to dela m ination. avago technologies led confguration 1.59mm ? esd precaution m ust be properly applied on the soldering station and personnel to prevent esd dam age to the led com ponent that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? reco mm ended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat te m perature 105 c max. - preheat ti me 60 sec max - peak te m perature 250 c max. 260 c max. dwell ti me 3 sec max. 5 sec max note: 1. above conditions refers to m easurem ent with ther m ocouple m ounted at the bottom of pcb. 2. it is reco mm ended to use only bottom preheaters in order to reduce ther m al stress experienced by led. ? wave soldering para m eters m ust be set and m aintained according to the recommended te m perature and dwell tim e. custom er is advised to perfor m daily check on the soldering profle to ensure that it is always confor m ing to recommended soldering conditions. note: electrical connection between botto m surface of led die and the lead fra m e is achieved through conductive paste. ? any align m ent fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal m aterial is reco mm ended as it will absorb less heat during wave soldering process. ? at elevated te m perature, led is m ore susceptible to m echanical stress. therefore, pcb m ust allowed to cool down to roo m tem perature prior to handling, which includes re m oval of alignm ent fxture or pallet. ? if pcb board contains both through hole (th) led and other surface m ount com ponents, it is recommended that surface m ount com ponents be soldered on the top side of the pcb. if surface m ount need to be on the botto m side, these com ponents should be soldered using refow soldering prior to insertion the th led. ? reco mm ended pc board plated through holes (pth) size for led co m ponent leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led. allngap device cathode
11 ammo pack drawing example of wave soldering temperature profle for th led refer to application note an5334 for m ore infor m ation about soldering and handling of high brightness th led lam ps. 0 3 0 1 0 0 2 5 0 2 0 0 1 5 0 1 0 0 5 0 t i m e ( m i n u t e s ) p r e h e a t t u r b u l e n t w a v e l a m i n a r w a v e h o t a i r k n i f e r e c o m m e n d e d s o l d e r : s n 6 3 ( l e a d e d s o l d e r a l l o y ) s a c 3 0 5 ( l e a d f r e e s o l d e r a l l o y ) f l u x : r o s i n f l u x s o l d e r b a t h t e m p e r a t u r e : 2 4 5 c 5 c ( m a x i m u m p e a k t e m p e r a t u r e = 2 5 0 c ) d w e l l t i m e : 1 . 5 s e c - 3 . 0 s e c ( m a x i m u m = 3 s e c ) n o t e : a l l o w f o r b o a r d t o b e s u f f i c i e n t l y c o o l e d t o r o o m t e m p e r a t u r e b e f o r e e x e r t i n g m e c h a n i c a l f o r c e . t e m p e r a t u r e ( c ) 2 0 1 0 4 0 5 0 7 0 9 0 8 0 6 0 1 8 . 0 0 0 . 5 0 ( 0 . 7 0 8 7 0 . 0 1 9 7 ) 6 . 3 5 1 . 3 0 ( 0 . 2 5 0 . 0 5 1 2 ) 1 2 . 7 0 1 . 0 0 ( 0 . 5 0 0 . 0 3 9 4 ) 9 . 1 2 5 0 . 6 2 5 ( 0 . 3 5 9 3 0 . 0 2 4 6 ) 1 2 . 7 0 0 . 3 0 ( 0 . 5 0 0 . 0 1 1 8 ) c a t h o d e 0 . 7 0 0 . 2 0 ( 0 . 0 2 7 6 0 . 0 0 7 9 ) 2 0 . 5 0 1 . 0 0 ( 0 . 8 0 7 0 . 0 3 9 ) a a v i e w a ? a ? 4 . 0 0 0 . 2 0 ( 0 . 1 5 7 5 0 . 0 0 8 ) t y p . a l l d i m e n s i o n s i n m i l l i m e t e r s ( i n c h e s ) . n o t e : t h e a m m o - p a c k s d r a w i n g i s a p p l i c a b l e f o r p a c k a g i n g o p t i o n - d d & - z z a n d r e g a r d l e s s o f s t a n d o f f o r n o n - s t a n d o f f .
12 packaging box for ammo packs f r o m l e f t s i d e o f b o x , a d h e s i v e t a p e m u s t b e f a c i n g u p w a r d . a v a g o t e c h n o l o g i e s a n o d e m o t h e r l a b e l c a t h o d e c a + ? a n o d e l e a d l e a v e s t h e b o x f i r s t . n o t e : t h e d i m e n s i o n f o r a m m o p a c k i s a p p l i c a b l e f o r t h e d e v i c e w i t h s t a n d o f f a n d w i t h o u t s t a n d o f f . l a b e l o n t h i s s i d e o f b o x . packaging label: (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2009 avago technologies. all rights reserved. obsoletes avo1-0701en av02-342en - january 15, 2009 disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nucle - ar facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l (ii) avago baby label (only available on bulk packaging) acronyms and defnition: bin: (i) color bin only or vf bin only (applicable for part nu m ber with color bins but without vf bin or part nu m ber with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part nu m ber that have both color bin and vf bin) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only

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